FabTime Newsletter Community Announcements Page

The announcements below are from the FabTime Cycle Time Newsletter, Volume 26, No. 5, published on December 4, 2025. We are delighted to announce the updated version of our FabTime reporting software, as well as the appointment of INFICON’s John Behnke as Co-Chair of the SEMI Smart Manufacturing Global Executive Committee and the publication of a new article about advanced packaging. 

Past issues of the newsletter are available for subscribers to download in PDF format. Existing subscribers can find the archive link in your most recent email newsletter. New subscribers will see the link upon registering. 

• Register for the newsletter here
• Main article for Volume 26, No. 5: Fab Trade-Offs: Higher Cycle Time for Higher Yield
• Subscriber discussion forum for Volume 26, No. 5
• Reach out to newsletter editor Jennifer Robinson here

FabTime version 2509.0.0 was released on September 30, 2025. It is running on our demonstration server and is available for installation at customer sites. Users can now:

1. Color boxplots by a third variable to identify causal/correlated factors. A statistical analysis is available to suggest useful “color-by” variables. In the example below, we see boxplots of UPH by tool colored by product, revealing a bi-modal distribution by product for Stepper 02. 

2. Receive better answers from AskJen™, which now searches past FabTime newsletters and help articles. For example, the response below draws from the help page for a metric called Earned Plan Hours. The new system also includes footnotes and suggested follow-up questions, making the answers generally more useful.

3. Unstack stacked charts to get a better visual comparison. By clicking “Unstack crosstab chart” below any stacked chart and selecting “Activate,” users can view data side by side instead of stacked, as in the example below. The chart shows WIP by Area. Unstacking makes the decline in Photo WIP and the rise in Implant WIP visible.

The updated version also includes:

• Security updates and bug fixes
• INFICON look-and-feel (to match other Smart Manufacturing applications)
• Improved within-application help (including the addition of recent FabTime newsletters)
• Our NexGen (d3) charting engine as the default

Reach out to Jennifer for more information or (for customers) to preview the updated version on our demonstration server.

INFICON is pleased to announce that John Behnke, Head of INFICON Smart Manufacturing initiatives, has been appointed co-chair of the SEMI Smart Manufacturing Global Executive Committee (GEC). The GEC is a strategic leadership group of SEMI member companies and partners that guides industry-wide initiatives in smart manufacturing. 

John is a recognized leader in semiconductor manufacturing, with extensive experience spanning process engineering, fab operations, and strategic technology leadership. At INFICON, he has been instrumental in advancing the company’s Smart Manufacturing strategy, driving innovation in autonomous manufacturing, data analytics, and integrated process optimization for semiconductor fabs globally. 

“John’s deep industry expertise and commitment to innovation make him an exceptional choice to help lead the SEMI GEC,” said Oliver Wyrsch, CEO, INFICON. “His appointment reflects INFICON’s ongoing commitment to innovation, collaboration, and driving meaningful progress in data-driven decision-making and operational excellence in semiconductor manufacturing.”

In his role as GEC co-chair, John will help guide SEMI’s global Smart Manufacturing agenda, focusing on:

• Defining and advancing the Smart Manufacturing vision for the semiconductor ecosystem
• Driving collaboration across regional chapters to align global initiatives and close capability gaps
• Championing strategic priorities including Factory of the Future, Sustainability, and Future Talent development

INFICON has been a dedicated supporter of SEMI’s global Smart Manufacturing Initiative, contributing expertise and leadership to advance intelligent manufacturing solutions across the semiconductor industry. Learn more in our member success story on SEMI.org.

Speaking of SEMI, the next SEMI Fab Owners Alliance (FOA) meeting, the Q1 Collaborative Forum, will be held at the Austin Marriott South in Austin, Texas, in February. The meeting will include a golf outing, one-and-a-half days of case studies, and multiple evening social activities. There will also be a pre-meeting dinner and social activity for the Women of the FOA (for which Jennifer is on the governing council).

As devices get smaller and chips become denser, manufacturers are looking for ways to continue increasing performance while minimizing power consumption and footprint. This is where advanced packaging plays a critical role. In this new article we discuss:

• Why advanced packaging matters
• The role of semi fabs in advanced packaging
• Solving the supply chain puzzle
• Integrating sensor technologies
• Meeting demands of the future

For more reading from the FabTime newsletter, see:

• Main article for Volume 26, No. 5: Fab Trade-Offs: Higher Cycle Time for Higher Yield
• Subscriber discussion forum for Volume 26, No. 5