SC26, the International Conference for High Performance Computing, Networking, Storage, and Analysis, brings the global HPC community together in Chicago for a week of technical programs, research, and exhibits.
Date
17 Nov 2026 - 19 Nov 2026
Location
Chicago, IL, USA
Booth
6213
INFICON at SC26 – Leak-tight cooling for high-performance computing
AI and HPC workloads are pushing rack power densities higher, and liquid cooling is becoming central to data center design. Even a small leak in a cooling loop can cause downtime, damage expensive hardware, and upset thermal balance. Keeping these systems leak-tight starts with precise testing of cooling components long before they reach the data center floor.
Join us at SC26 in Chicago and discover how INFICON solutions help prevent fluid loss, protect critical hardware, and keep data center cooling running reliably.