监测器
重新设置过滤器以获得结果。
Compact deposition monitor built with ModeLock technology to maximize reproducibility and uniformity with the highest thickness accuracy, best measurement resolution, and lowest rate noise
- INFICON ModeLock technology provides the longest crystal life and ensures the most stable, highest resolution rate and thickness measurement available, even at very low rates
- Maximize yield with the best QCM thickness measurement possible
- Single channel rate and thickness monitor without unnecessary added features to compact size and minimize cost
- EtherCAT communications for seamless integration
Compact deposition monitor built with ModeLock technology to maximize reproducibility and uniformity with the highest thickness accuracy, best measurement resolution, and lowest rate noise
- INFICON ModeLock technology provides the longest crystal life and ensures the most stable, highest resolution rate and thickness measurement available, even at very low rates
- Maximize yield with the best QCM thickness measurement possible
- Single channel rate and thickness monitor without unnecessary added features to compact size and minimize cost
- Ethernet communications for seamless integration
SQM-160 使用成熟的 INFICON 石英晶体传感器技术在薄膜沉积过程中测量速率和厚度。两个传感器输入为标准输入，另外四个传感器输入为可选输入。
- 两个标准测量通道，另外四个可选
- 模拟输出便于记录速率/厚度
- 高分辨率选件：0.03 Hz，10 读数/秒
- RS-232 标准接口，可选择连接 USB 或以太网
STM-2XM 是一款双通道速率/厚度监测仪，它将高精度与灵活编程相结合，易于操作，价格实惠。
- 两条测量通道
- 用于速率、速率偏差或厚度的四个模拟输出
- 八个可编程的数字输入
- 八个可编程的数字输出
STM-2 将 USB 连接的简单与精密测量引擎的精度相结合，在一个结构紧凑、价格便宜的封装内实现所有功能。STM-2 小巧、简单，方便安装和操作。
- 低成本仪器
- USB 连接
- 内部振荡器
- 每秒 10 次测量时的高精度
SemiQCM™ SR sensor is one component of a system for precursor monitoring with the other components being an IMM-200 and FabGuard (version 19.12.00-a or higher).
- Real-Time, in situ process monitoring
- Prevent over-etching, identify chamber clean end point
- Identify equipment or process state fault
real-Time, in situ process monitoring, prevent over-etching, identify chamber clean end point
- Real-Time, in situ process monitoring
- Prevent over-etching, identify chamber clean end point
- Identify equipment or process state fault